LASC

지정상품

• 결정 웨이퍼 에칭 처리업(Crystal wafer etching treatment)
• 반도체 밀봉 처리업(Semiconductor sealing processing)
• 반도체 및 집적회로 관련 주문제작 및 조립업(Services of manufacturing and assembling semiconductors and integrated circuits according to customer specifications)
• 반도체 및 집적회로 주조업(Foundry services of semiconductors and integrated circuits)
• 반도체 및 집적회로 패키징 처리업(Semiconductor and integrated circuit packaging processing)
• 반도체 에칭가공처리업(semiconductor etching processing)
• 반도체 제조 대행업(Custom manufacture of semiconductors for others)
• 반도체 칩 주조/절단 및 패키징 공정 처리업(Foundry, semiconductor chip cutting and packaging processing services)
• 실리콘 웨이퍼 및 반도체 연마업(Polishing services for silicon wafers and semiconductors)
• 실리콘 웨이퍼 및 집적회로 관련 주문제작업(Manufacturing silicon wafers and integrated circuits according to customer instructions)
• 실리콘 웨이퍼 및 집적회로 조립업(Assembly service of silicon wafer and integrated circuit)
• 웨이퍼 에칭 및 다이싱 처리업(Wafer etching and dicing processing)
• 웨이퍼 주조업(Wafer Foundry)
• 자동차 반도체 관련 주문제작 및 조립업(Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions)
• 자동차 웨이퍼 관련 주문제조 및 조립업(Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions)
• 집적회로 맞춤제조 및 가공처리업(custom manufacture and processing of integrated circuits)
• 집적회로 에칭 처리업(Integrated circuit etching treatment)
• 집적회로 절단 또는 성형 처리업(Cutting or forming of integrated circuit)
• 집적회로/포토마스크/컴퓨터칩 조립업(Assembling integrated circuits, photomasks and electronic or computer chips for others)